_{Original Date: 11/01/2004
Revision Date: 01/18/2007}
Summary

Best Practices

Design
• Assessment of Electronic Connector Reliability
• Design for Harsh Environments: Low-Temperature Operation
• High-Temperature Electronics Design for Reliability
• Manufacturing Cost Modeling
• Parts Selection and Management
• Virtual Qualification (Simulation-Assisted Reliability Assessment)
Test
• Electronic Parts Uprating
• Physics-of-Failure Strategies for Accelerated Stress Testing: Product Qualification
• Root-Cause Analysis

Information

Design
• Design Refresh Planning
Test
• Characterization of Degradation Behavior of Electronic Materials
• Integrated Prognostics and Health Monitoring for Electronic Products and Systems
• Thermal Design and Analysis of Electronic Products and Systems
Logistics
• Electronic Part Obsolescence Forecasting

For more information see the Point of Contact for this survey.