Original Date: 10/04/1993
Revision Date: 01/18/2007

Until the late 1980s, Hamilton Standard Electronic Manufacturing Center (HSEMC) used an MRP-based manufacturing strategy. However, in an effort to reduce cycle time and improve responsiveness to its customers, HS initiated a strategy to improve its factory that is still in place. At the heart of this strategy is a continuous flow manufacturing (CFM) technique and a multi-faceted approach that has changed the entire organization.

To improve its overall manufacturing process, Hamilton Standard made various changes to the Farmington, CT factory. Teams were formed consisting of assemblers, technicians, production control planners, engineers, and supervisors. These teams reviewed virtually every process to determine what measures could be taken to decrease cycle time and improve test yields, while eliminating non-value added operations. Teams were responsible for other metrics such as reduction in rework and repair, conformance to schedule, and linearity of production. In addition, associates were cross trained for department flexibility, and an operator certification program was developed to help reduce separate inspection processes.

Equipment improvements were also made in areas with major impact. Surface mount assembly was accomplished faster with fewer errors by the addition of an automated pick and place system that measured the value of passive components prior to placement. New soldering systems reduced solder defects in through-hole assemblies. The introduction of water soluble cleaning technologies reduced hazardous waste, eliminated the use of ozone depleting chemicals, improved cleanliness on assemblies, improved cycle times and reduced conformal coat defects.

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