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Original Date: 08/20/2001
Revision Date: 12/14/2006
Information : Plastic Chip on Flex Transmit/Receive Module Fabrication Process
The Plastic Chip on Flex Transmit/Receive Module Fabrication Process represents the next generation of the baseline ceramic process, and is used in shipset, commercial, and space applications. Lockheed Martin Naval Electronics & Surveillance Systems-Surface Systems and other activities are investigating its uses in stress testing and reliability assessment.
In the late 1980s, the baseline ceramic process was invented by General Electric’s Corporate Research and Development Center. A commitment for research funding with this Center was made as part of a 1992 agreement to General Electric in the General Electric-Aerospace Group sale to Martin Marietta (later Lockheed Martin). The Plastic Chip on Flex (PCOF) Transmit/Receive (T/R) Module Fabrication Process represents the next generation of the baseline ceramic process.
The PCOF T/R Module Fabrication Process uses low-cost, commercial-off-the-shelf (COTS) materials. The process also features quick turnaround prototyping (no long lead materials), and 3X weight and size advantages over equivalent chip and wire designs. The PCOF T/R Module Fabrication Process is used in shipset, commercial, and space applications.
As estimated by the Envision Cost Model, the PCOF T/R Module Fabrication Process produced a cost savings to the Navy of $7 to $10 million per shipset. Lockheed Martin Naval Electronics & Surveillance Systems-Surface Systems (NE&SS-SS) is currently testing this process for Navy use with Highly Accelerated Stress Testing. Reliability Assessment is also underway in cooperation with the Naval Surface Warfare Center, Crane Division; and the Computer-Aided Life-Cycle Engineering, Electronic Package Research Center.
For more information see the
Point of Contact for this survey.
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