Original Date: 08/15/1991
Revision Date: 01/18/2007

MagneTek Defense Systems (MDS) uses an automated dip solder system to solder most electrical components to the circuit boards. This system is well suited to MDS's low volume/high mix circuit board assembly operation. Because it is not as complex to set up and run as a wave solder soldering system, it offers a viable alternative to smaller electronic assembly facilities performing hand soldering. Since typical runs at MDS consist of 15 to 18 boards, the rapid setup time provides another substantial benefit.

A conveyor moves the stuffed circuit board through a foam fluxer and dips the assembly into a solder pot. The system can be programmed for up to nine automatic run sequences and can be used for board sizes from 2 inches by 1 inch to 14 inches by 14 inches. MDS maintains that the system cost ($16,000 in 1990 with two trained operators) was recovered after just one highly populated production run.

Since implementing this system, MDS has experienced a reduction in solder joints requiring rework from 10% to below 2% with good consistency. The dip solder system provides good control with the board topside pre-heat temperature and has a small footprint of approximately 3 feet by 8 feet. Also by implementing a dip solder system, the number of previously required personnel to hand-solder joints has been reduced by almost 50%. MDS recently had their soldering process audit certified to MIL-M-28787C by a SEM Quality Audit team.

For more information see the Point of Contact for this survey.