Original Date: 10/10/2005
Revision Date: / /
Best Practice : Single Minute Exchange of Die
Raytheon’s Integrated Air Defense Center facility has achieved impressive gains by using the Single Minute Exchange of Die system as demonstrated through the use of the Manufacturing Excellence Model element, the critical paths for processes, proper inventory control, and cellular manufacturing.
Raytheon’s Integrated Air Defense Center (IADC) implemented the Single Minute Exchange of Die (SMED) system in April 2005 in an effort to reduce setup time and improve productivity. This was done by introducing smaller batch sizes to manufacturing while reducing lead-time.
Prior to SMED, the IADC was collecting data for Raytheon Six Sigma™ (R6 σ ) projects and capital justification only. Priorities were not established, no process for machine setup existed, and raw material locations were not properly identified. Today, Raytheon has increased employee awareness of the SMED process plant-wide. The Manufacturing Excellence Model (MEM) includes SMED; critical paths for processes have been identified; and metrics are displayed and used. Proper inventory control procedures are in place, and operators know exactly how much they need to produce. Designated areas for raw material are established, while materials are stacked in order of fabrication. Current job and next-job documentation are located at the machine.
Since April 2005, the HS4 machine setup improvement has stabilized tooling, allowing each tool to be verified and tool-set sheets to be corrected; preset tooling has been implemented for improved consistency from part to part; and gatekeeper has been identified for HS4 tool package to maintain integrity and consistency. Panel hours have improved from 2 cabinets per month to 6 cabinets per month, with a 52% improvement across all 45KV parts machine.
Additionally, employee-designed sheet metal plates with quick disconnect at 24 SMA locations have led to a 29% reduction in calibration hours for 24 RF cable connections and improved missile setup. The easy installation of a simplified fuze cover design has further improved cycle times by reducing the number of iterations in aligning the fuze cover. The new test cover is installed easily and reduces internal component damage. Production time has improved by approximately 38,640 hours in the Circuit Card Assembly (CCA) area, which represents a nine-fold increase in productivity.
The implementation of the SMED process at the IADC has significantly increased productivity, increased setup time, and minimized waste.
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