Original Date: 09/14/1998
Revision Date: 01/18/2007
Information : Electronic Soldering
Since acquisition reform became a DOD initiative, soldering at Raytheon Missile Systems Company (RMSC) has changed a great deal. At one time, engineers had to be familiar with 35 different soldering specifications, each with their own set of exceptions, in order to judge solder joint quality. A lot of time was spent on making the joints look right. Today, RMSC’s Electronic Soldering process is an advanced technology that produces highly reliable solder joints, and uses well-defined requirements, guidelines, and specifications; state-of-the-art equipment; specific materials; controlled processes; excellent skills training; and organized contractor flowdown.
ANSI/J-STD-001, Class 3 is the industry soldering standard used throughout the United States. RMSC’s soldering techniques were developed as well-defined processes, based on ANSI/J-STD-001 and the company’s ISO-9001 practices. Among the company’s capabilities are wave soldering, screen-printing, pick-and-place, reflow soldering, and cleaning. Tools, such as PROCAS, foster the understanding of critical processes, and provide effective customer communication and involvement, teaming, and metrics. Statistical process control is used for conveyor speeds, board preheat temperatures, solder heights, defect data trends, and reflow profiles. Training is done every 18 months, and emphasizes the workmanship associated with actual products. Experienced instructors also develop specific training programs around flex harnesses, chip soldering, tack soldering, and other product-related requirements.
The Electronic Soldering process has been recognized by RMSC customers as an effective solder assembly technique, featuring standard tools and processes. Through its effective skills training, RMSC ensures the transfer of knowledge among employees. Since implementing the Electronic Soldering process, RMSC produces highly reliable solder connections, and improved its competitive edge.
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