The components showed an appearance of nonwetting on a
large number of terminals on both connectors. The connector that was not steam
aged had 31 terminals exhibiting regions of nonwetting, while the connector
that had been steam aged and solderability tested had 16 terminals exhibiting
regions of nonwetting. The majority of the nonwetting at 10X magnification was
seen as pin holes. The solder did not form a smooth surface over the terminal.
At higher magnification, there was evidence of areas of nonwetting (Figure
2
).
