7.14.3 __Finite Element Analysis
Procedure__

The following is a brief outline of a typical Finite Element
Analysis - that of a hypothetical microcircuit/printed circuit board interface
application.

First, the entire device (or a symmetrical part of the entire
device) is modeled with a coarse mesh of relatively large sized elements such
as 3-dimensional brick elements. The loading, material property, heat sink
temperature, and structural support data are entered into the data file in the
proper format and sequence as required by the FEA solver. The deflections and
material stresses for all node point locations, see Figure 7.14-1, on the
model are the desired output from the FEA.

**Step 1: Perform
FEA**

(1) Establish FEA mesh

(2) Apply loading and boundary
conditions

(3) Perform
simulation