POWER AND GROUND PLANES
For copper thick film technology, solid ground or power planes
may not be used. Either a grid or a bus-type plane should be used. Lines wider
than 0.060 inch should be relieved by gaps so that in general the line width
does not exceed 0.060 inch. Examples of these types of planes are shown in
Figure 4-7. For analog modules, split planes are recommended to save layers.
An example of such a split power plane with vias for the +5V and +5V return
planes is also shown in Figure 4-7.