Reliability, Maintainability, Quality and Availability - are
requirements imposed or analyses performed to insure that the system is
operationally ready for use when needed, will successfully perform
assigned functions, and can be operated and maintained within the scope of
the logistics concept and plan.
The following measures of effectiveness or equivalent are identified in
measurable quantifiable terms based on similar systems and
available detail design information:
- Mean Time Between Failures (MTBF).
Mean Time To Repair (MTTR).
- Frequency and duration of
preventive or scheduled maintenance.
- Battle damage repair
Readiness thresholds for all system downtime,
including scheduled maintenance.
5.2 Reliability, maintainability and
availability of the system are continually assessed through analyses and
testing to ensure life cycle objectives will
Design and layout minimizes unnecessary removal of items to gain
maintenance and minimizes design of special tools.
Maintainability predictions and task time analyses are completed for
or shipboard maintenance as a minimum.
Mock-ups, prototypes and/or simulations to assess accessibility are
completed as part of
5.6 Accessibility and maintainability are validated through
5.7 A quality program is established
to assure implementation of
design requirements into process control characteristics.
|6. Design Analyses - are planned and conducted to
assess the strengths and weaknesses of the design and its effect on
||6.1 Top-down analyses (e.g., failure
modes, effects and criticality analysis; single point failure analysis;
fault tree analysis) from system level to lowest
part level are performed as the design progresses.
6.2 Sneak circuit analysis is
performed as a minimum on critical circuits, circuits that perform
frequent switching functions, and areas of
Thermal analysis includes results from analyses of the detail
designs, thermal surveys/tests, and operational tests.
Stress analyses (mechanical/finite element, electrical, and thermal)
are conducted against
case analyses are performed to identify tolerance stack-up and drift
in circuit parameters. Calibration and measurement systems
are included in these analyses.