Packaging materials can cause degradation of component and PWB solderability. Some known contaminants are silicone, sulphur compounds, polysulfides and acids. Acceptable requirements and their controls have not been established.
Requirements for containers have been driven by the need to control electrostatic discharge (ESD) and not solderability. The awareness of this ESD sensitivity has resulted in special component packaging and handling techniques during manufacturing, testing, usage, and shipping. Some anti-static packaging materials have contributed to the degradation of solderability.
(1) Storage containers should be of a material that does not introduce gasses or chemicals that could be detrimental to the solderability of the PWB or its components.
(2) Containers for electrical sensitive devices should conform to DoD-STD-1686.
(3) Identify specific requirements of the container to the supplier.
8.4 Future Investigations
Recommended areas for investigation include:
(1) Develop a standard test for containers to determine their effects on solderability after storage.
(2) Identify acceptable materials for storage containers.