At the first BMP Workshop held in Ridgecrest, California on 5-6 May 1987, component solderability was identified as the number one problem in the electronics industry. A number of industry and government representatives volunteered to serve on a committee to develop recommended guidelines to improve solderability. This, the first technical guideline document published by the Best Manufacturing Practices (BMP) Program Office, is the result of the committee's efforts.
These guidelines provide a compilation of the best practices being used by industry to control solderability. The intent of this document is to provide proven guidelines that can be employed by government and industry to solve a critical industry-wide problem.
I encourage the use of these guidelines as a supplement to existing specifications and standards, and as a vehicle to revise those specifications and standards to reflect best practices for solderability. As the technology of soldering in electronics continues to advance, I invite readers to keep my office informed of any developments which ought to be considered in future revisions of this publication.
I am convinced that with continued assistance and cooperation between the Navy and industry on solderability and other technical issues concerning the design and manufacture of reliable products, we can solve problems and make a significant improvement in Fleet readiness.
W. J. Willoughby, Jr.
Director: Product Integrity
Office of the Assistant Secretary of the Navy (Research, Development and Acquisition)
