The Test, Analyze, and Fix (TAAF) process is a closed-hop reliability growth methodology. This technical brief provides in a single, concise source document TAAF program management methods, engineering practices, and suggested implementation contract language for the program manager and engineer. Because such a document has not been previously available, there is considerable misunderstanding regarding the purpose and scope of the TAAF process. Some, for example, equate TAAF with reliability demonstration testing. Nothing could be further from the truth. The purpose of TAAF is not to prove that a reliability goal has been met, but rather to deliberately search out and eliminate deficiencies In TAAF, failures are welcome. The TAAF concept is necessary because, even with the very best of modern engineering methods, initial designs for mechanical or electronic systems that are complex or that involve new technology have reliability deficiencies that are difficult to fully detect and eliminate through design analysis. The TAAF process surfaces these problems early and eliminates them before rate production. Tenfold reliability improvements are not unusual.
Our goal in publishing this document is to help the program manager and engineer assure the design and delivery of reliable weapon systems.
FRANK S. GOODELL, BGen, USAF
Special Assistant for Reliability and Maintainability
SAF/AQ and DCS/LE
W.J. WILLOUGHBY, JR. Director,
Reliability, Maintainability, and Quality Assurance Office
of the Assistant Secretary of the Navy (Shipbuilding & Logistics)
S.J. LORBER, Deputy Chief of Staff
for Product Assurance & Testing Army Material Command HQ AMC