As is the case with almost any technical discipline, the degree to which it
is understood, or misunderstood, significantly affects its proper
utility. This potential problem area becomes real when technical
requirements are being addressed. While the subsequent definitions are
not universal, they are provided so that users of this manual will be
reading, interpreting, and applying the same baseline terms.
BONDED STOCK - Terminology used for ensuring part integrity.
Bonded stock occurs after the part manufacturer has placed the parts
in a sealed container. The container must protect the devices from
handling as well as ESD damage. If the parts are repackaged or lots
split outside the manufacturers facility, the parts are no longer
considered to be in bonded stock.
COLD PLATE - This terminology is used in thermal cycle stress screening.
The original definition of a cold plate refers to a housing that
would circulate cold fluid to assist in cooling the thermal chamber.
For the purposes of this document, the cold plate refers to a true
cold plate or a portion of the fixture that holds the hardware.
DESTRUCTIVE PHYSICAL ANALYSIS (DPA) - Systematic, logical,
detailed examination during various states of physical disassembly of
a part to identify problems or discrepancies and their probable
cause. Normally conducted to verify conformance with applicable
design and process requirements.
EQUIPMENT OPERATING DESIGN SPECIFICATION LIMITS (Thermal) -
Maximum and minimum operating temperature limits to which an equipment
is designed to withstand that are imposed by the equipment
specification or contract.
EQUIPMENT STORAGE SPECIFICATION LIMITS (Thermal) - Maximum and
minimum storage temperature requirements that are imposed on a design by
the equipment specification or contract.
GLASSIVATION (not to be confused with the term passivation) - The top
layer of transparent insulating material that covers the active chip
area including metallization except bonding pads and beam leads, and
provides protection of the junctions and surfaces of semiconductor
chips from harmful elements and particles.
INPUT STIMULUS - The vibration level measured on a fixed edge of the
Printed Wiring Board or mounting fixture undergoing
LATENT DEFECT - A flaw in a part or item that would eventually prevent it
from meeting its functional requirement when operating within
its specified environment and within its specified
MANUFACTURING DEFECT - A flaw caused by in-process errors or
uncontrolled conditions during assembly, test, inspection, or
MINIMUM QUALITY LEVEL SCREENED PARTS - Parts which have
been subjected to a process or combination ofprocesses on a
10096 basis for the purpose of identifying and eliminating
defective, abnormal, or marginal parts. Each part must be, as
a minimum, in full compliance with MIL-STD-883 Method 5004, for
integrated circuit devices; MIL-S-19500 Table 11, for semiconductor
devices; and applicable test methods of MIL-STD-202 for
Established Reliability (ER) devices. (See applicable Military
Specification for specific devices for test methods).
MODULE - A self-contained collection -of chassis mounted parts
and/or PWAs within one package performing a specific function
or group of functions and is removable as a single package
from an operating system.
NEW TECHNOLOGY PART - A semiconductor device, integrated circuit,
or hybrid circuit that is available for sale by a part
manufacturer, but which has been on the market for less than
NORMAL INCOMING TESTING - Incoming process checks and/or tests on
parts, performed by the equipment contractor, spares
contractor, or Class A or B depot, that are part of their
existing incoming processes, and which form the basis of part
acceptance from the part manufacturer or