A representative from the Best Manufacturing Practices (BMP) Program and Center of Excellence (COE) was among attendees at the Eighth Annual Microelectronics Reliability and Qualification Workshop (MRQW). This year's conference was held December 6-7, 2006, at the Westin Los Angeles Airport Hotel in Los Angeles, California. Approximately 110 government and industry representatives met during the two-day event that was jointly sponsored by the Aerospace Corporation, the Jet Propulsion Laboratory (JPL), and the National Aeronautics and Space Administration (NASA) to discuss the latest results in areas of microelectronic device reliability and qualification methodologies. Technical sessions were presented on advanced technology reliability issues, advanced microelectronic packaging issues, field-programmable grid array applications, product reliability and qualifications, and radiation effects on microelectronics. Keynote speakers from the JPL and the Intel Corporation discussed the challenges of microelectronics qualification for robotic space missions and the reliability and challenges associated with the current trends in silicon technology. MRQW's mission is to provide an open forum for discussion of all areas of microelectronic device reliability and qualification for microelectronics targeted for space applications. BMP's participation in this event represents the Center's support of sharing best practices and resources in support of the DoD's efforts to strengthen the U.S. industrial base.